Nanotechnology for future energy efficient automotive electronics

Prof. Cian ? Math?na, Tyndall National Institute and PowerSwipe project co-ordinator said ?Europe is a global leader in automotive systems with competencies covering the full supply chain from the main OEMs (Audi, BMW, Daimler, Fiat, PSA, RSA, VW) to tier one suppliers (Bosch, Continental, MagnetiMarelli) to leading semiconductor companies (Infineon Technologies, ST). The PowerSwipe project is focussed on innovating at the system level, rather than design/production at the component level, which is a strategic differentiator for the automotive industry in maintaining Europe?s leading position in this growing market.?

The 3 year PowerSwipe project, with a budget of ?5 million, is funded by the European Union under the 7th Framework Programme for Research and Technology Development in Information and Communications Technologies. This is the first EU funded project in magnetics-on-silicon. The PowerSwipe consortium includes, Tyndall National Institute, Infineon, IPDiA, Universidad Polit?cnica de Madrid, Universit? de Lyon ? Claude Bernard and Robert Bosch.

Today?s cars contain up to 70 electronic control units, using sophisticated silicon chips known as micro-controllers. Currently, these micro-controllers are supplied with a range of different voltages from power supplies which take up a lot of space and waste energy. The vision for automotive control units in 2020 is that these power supplies will be miniaturised and integrated directly with the micro-controller chip, thereby dramatically saving space and weight while at the same time reducing energy use, CO2 emissions and manufacturing costs of next generation automotive electronics systems.

Commenting on the project partnership, Prof. ? Math?na added: ?The consortium has the ideal blend of know-how, skills and technologies to establish Europe as the leading global player, over the coming decade, by creating a competitive, European supply chain in power supply on chip platforms for complex System on Chip (SoC) applications. PowerSwipe will achieve key innovations and breakthroughs by developing new advanced component and circuit technologies in combination with methodologies and tools for design of fully integrated power management systems, which will become a key building block for advanced nano-electronic components and systems over the next decade.? Prof. ? Math?na explained: ?The PowerSwipe project will address a key roadblock for PowerSoC by, for the first time, miniaturising and integrating state-of-the-art, high density trench capacitor substrate technology, from IPDiA, with Tyndall?s novel thin film magnetics on silicon to deliver a multi-component LC (inductor-capacitor) interposer which will be combined, with the micro-controller chip, in a 3D stack, using Infineon?s embedded wafer level manufacturing process.?

Source: http://www.nanowerk.com/news2/newsid=30191.php

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